Low Melt Technology Adhesives
Low-melt adhesives are used for bonding heat-sensitive materials – foam plastic, cardboard, low-melting plastics, etc. They are popular in the furniture industry for quick pasting of fittings, decorative finishes and bonding fabric to wood, plywood and chipboard. Recommended for quick corrugated cardboard packaging. They are used with special 3M low melt LT applicator only. |
ProductsFeaturesSelecting an Applicator
Low Melt Technology Adhesives
[product_table category=”low-melt-technology-adhesives” columns=”sku,name,price,add-to-cart” sort_by=”short-description” sort_order=”asc”]
Features
Code | Melting point | Heat resistance | Open time | Peel strength (+22оС) | Shear strength (+22оС) | Features |
---|---|---|---|---|---|---|
Standard melting point adhesive 177°–196°C (350°– 385°F) | ||||||
3731 | 157°С | 130°С | 30 sec. | 22 | 490 | High heat resistance and strength. For gluing polycarbonate, polypropylene, polyethylene and other plastics. |
3738 | 86°С | 54°С | 50 sec. | 13 | 375 | Glue Standard. For gluing wood, chipboard, some plastics, paper, fabrics. High glue feeding speed and long curing time. |
3747 | 104°С | 63°С | 45 sec. | 20 | 430 | Universal. It is recommended for gluing not heavy parts from wood, plastic and other materials. |
3748 | 145°С | 80°С | 45 sec. | 18 | 250 | Industrial. Lasting, elastic, longeval. Does not cause corrosion of copper. It has insulating properties and excellent resistance to impact loads. For mounting electronic components on printed circuit boards and gluing plastics. |
3764 | 85°С | 60°С | 40 sec. | 14 | 390 | Transparent. For gluing polycarbonate, polypropylene, polyethylene and other plastics. Flexible, shockproof at low temperatures. |
3779 | 163°С | 150°С | 25 sec. | 18 | 700 | Heat resistant. Very durable. Resistant to oil and fuel. Quickly grasp. It is used mainly in electronics. |
3789 | 132°С | 104°С | 50 sec. | 16 | 570 | Glue Premium. For gluing plastic, vinyl and wood. Shockproof. Resistant to oils and fuels |
Low melting point adhesive 121°–132°C (250°– 270°F) | ||||||
3762 | 96°С | 54°С | 25 sec. | 6 | 480 | Quickly grasp. For packing and repair. The gluing of wood, chipboard, corrugated board, foam. |
3792 | 81°С | 60°С | 40 sec. | 13 | 350 | Transparent. The gluing of wood, chipboard, corrugated board, foam, fabric, furniture, upholstery and light materials. |
3798 | 88°С | 49°С | 30 sec. | – | – | Removable “viscous adhesive” for various surfaces. Easily removable without residue. |
Selecting an Applicator
3M Scotch-Weld Hot Melt Applicator | Weight, kg | Output, kg/h | Temperature, °F (°C) | Power (120V) | Adhesive | ||
---|---|---|---|---|---|---|---|
Type | Size | ||||||
Low Melt Applicators | 3M™ Hot Melt Applicator LT (Low Temp) | 0,28 | 1,18 | 265 (129) | 150W | TC | 5/8 x 2 |
3M™ Hot Melt Applicator LT with Quadrack Converter (Low Temp) | 0,39 | 1,18 | 265 (129) | 150W | Q | 5/8 x 8 | |
3M™ Hot Melt Applicator PGIILT (Low Temp) | 1,95 | 2,72 | 265 (129) | 500W | PG | 1 x 3 | |
Hot Melt Applicators | 3M™ Hot Melt Applicator TC | 0,28 | 1,59 | 385 (196) | 150W | TC | 5/8 x 2 |
3M™ Hot Melt Applicator TC with Quadrack Converter | 0,39 | 1,59 | 385 (196) | 150W | Q | 5/8 x 8 | |
3M™ Hot Melt Applicator PGII | 1,95 | 3,4 | 385 (196) | 500W | PG | 1 x 3 | |
3M™ Hot Melt Applicator AEII | 0,57 | 1,81 | 400 (204) | 100W | AE | 1/2 x 10, 1/2 x 12 | |
Variable (Low Melt or Holt Melt) | 3M™ Hot Melt Applicator EC | 0,68 | 2,5 | 260–450 (127–232) | 350W | Q | 5/8 x 8 |
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